Micron announced the demonstration of a 512GB DDR5 RDIMM on multiple server platforms, with speeds up to 9,200 MT/s, and said AMD and Intel are both validating the module. It stacks DRAM dies connected by through-silicon vias, enables up to 12TB of DDR5 in a 24-slot dual-socket server, and is expected in volume production in the second half of 2027.
For AI infrastructure, the mechanism is keeping larger datasets resident in main memory, which Micron says reduces reliance on slower storage tiers; it also cites more than 60% lower operating power than four 128GB RDIMMs. The release gives no pricing or inference benchmarks, and its performance figures are vendor claims.